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Quick Cure Encapsulation Epoxy (Anti-Theft)

$260.00 CAD
Type: Epoxy resin
Kit type
SKU: NPQCEE7.5K

Quick Cure Encapsulation Epoxy


The Quick Cure Encapsulation Epoxy is specifically formulated to protect copper cables year-round from theft by providing a robust barrier against cutting tools. When combined with high concentrations of silica sand, this epoxy creates a highly effective anti-theft layer. The epoxy is applied in a half-cylinder mold (radius of 2-3") encasing the copper cable, ensuring protection even in cold temperatures and under continuous vibrations from passing trains. Adhering to recommended handling practices, mixing ratios, and safety measures will provide optimal protection for cables against theft while maintaining durability in demanding environmental conditions.

dissection scheme of the copper cable protected by Nerpa Quick Cure Encapsulation Epoxy

Key Features:

  • Anti-theft protection: This advanced epoxy system is engineered to form an exceptionally durable protective shell when blended with silica sand, creating a composite material with superior resistance to mechanical cutting, grinding, and abrasion.
  • Ease of application: Compatible with standard drill-mounted mixing attachments, this epoxy eliminates the need for specialized equipment during preparation.
  • Wide temperature application window: This formulation maintains workability across an extended temperature range, performing reliably from -10°C to 25°C, enabling application in challenging environmental conditions.
  • Quick return to service: Achieves initial cure in approximately 1.5 hours, even at freezing temperatures, accelerating project timelines without compromising performance in cold environments.
  • Vibration & cold-resistant: Cures effectively and protects cables even in cold environments and under continuous vibration.
  • Optimal viscosity: Low unfilled mixed viscosity (180-250 cP at room temperature) allows for efficient incorporation of high volumes of silica sand.
Mixing ratio 4.2:1 by weight
Mixing ratio tolerance It is acceptable to slightly exceed resin amounts by up to 5%, but never add excess hardener.
Appearance (mixed) transparent yellow liquid (unfilled). Opaque slurry (filled with silica)
Total kit + silica occupied volume at 75% w/w silica load 15.7L
Intended application highly abrasive protective layers, quick-cure encapsulation of objects, anti-slip coatings
Working temperature -10°C to 25°C
Mixed viscosity 200 cP
Working time (150g @24°C) 8-10 min
Pot Life (150g @24°C) 12 min
Set to touch (150g @24°C) 30 min
Set to touch (150g @5°C) 90 min

Safe Practices:

  • Handling Precautions: Part A is mildly irritating, while Part B is corrosive and must be handled with extreme care.
  • Exothermic Warning: Quick Cure Encapsulation Epoxy is an exothermic system capable of generating large amounts of heat during the application phase when the temperature outside exceeds 24°C.
  • Heat Generation: Unfilled layers of mixed resin and hardener thicker than 0.5 inches can generate dangerous heat levels within 30-40 minutes, potentially melting containers. NEVER LEAVE MIXING CONTAINERS UNATTENDED.
  • Temperature Monitoring: It is recommended to monitor the temperature during the application phase with an IR thermometer.
  • Strict Timing: Never leave the mixed resin and hardener unfilled in a bucket. Complete the mixing stage and application of the epoxy/sand mixture within 5-6 minutes after combining parts A and B.

Step-by-Step Application & Tips

  1. Preparation: Select an appropriately sized container (or, if the kit is intended to be used in full, use the pail with Part A, it will fit resin, hardener and 22.7 kg of silica) to accommodate the resin, hardener, and sand. Weigh the required resin amount in this container and the required sand amount in a separate container.

  2. Measuring: Add the hardener directly from the kit jug to the resin using scales to reduce waste and improve accuracy.

  3. Mixing the Epoxy: Begin mixing the resin and hardener with a mechanical mixer for optimal consistency. Mix until homogeneous (approximately 2 minutes), then continue mixing for an additional minute. Limit resin and hardener mixing to a total of 3 minutes.

  4. Incorporating Sand: Gradually add the premeasured silica sand to the resin mixture within an additional 2 minutes. Mix thoroughly by hand and uniformly coat the sand using a robust stirring stick.

  5. Pouring: Pour the sand/resin mixture into the mold.

  6. Bubble Release: After approximately 5 minutes, air bubbles may surface. Quickly eliminate these bubbles using a brief propane torch blast held approximately 15 cm away from the resin surface.

  7. Induction & Heating (-10 to +5°C): At these temperatures, expect an induction period of approximately 35-40 minutes post-mixing where no noticeable reaction occurs, after which heat will gradually increase.

  8. Induction & Heating (+5 to +24°C): At these temperatures, expect a shorter induction period of approximately 15-20 minutes post-mixing, after which the heat will gradually increase.

  9. Heat Distribution: As heat begins to rise (around 30-40 minutes at 5°C, shorter at higher temps), gently swirl or briefly remix the epoxy/sand mixture within the mold. This brings warmer interior material to the surface and cooler outer layers inward, ensuring uniform heat distribution and improving final performance.